The HEATBIND™ is a Solid Thermal Retainer:
- higher area of thermal interface
- push-pull action to lock/unlock the board
- suitable for Open VPX, Space VPX, Open SOSA, Compact PCI Serial and Compact PCI Serial Space applications
Product Description
The HEATBIND™ patent pending technology achieves the highest effective area of thermal interface between card and chassis for conduction cooled embedded computing applications. The HEATBIND™ was developed by Performance Interconnect in order to achieve a Solid Thermal Retainer.
HEATBIND™ achieves a higher area of thermal interface with a single junction between the monoblock frame and the solid retainer thereby reducing the thermal resistance of the system making it superior in performance to wedgelocks, ICE-LOKs or any other open or patented retainer technology.
The driving screw, has dual action onto the HEATBIND™ solid retainer: it pushes the retainer to lock and it pulls the retainer to unlock. Wedgelocks do not feature the push-pull action and consequently tend to remain wedged in the locked state even if the locking screw is loosen.
HEATBIND™ is suitable for Open VPX, Space VPX, Open SOSA, Compact PCI Serial and Compact PCI Serial Space applications.
We welcome any inquiry and we are glad to adapt HEATBIND™ to any card top frame or bottom frame configuration in both 3U and 6U designs.
